5SHY42L6500 ABB IGTC GTO module

The provided text describes ABB’s HiPak modules, high-power insulated-gate bipolar transistors (IGBTs) designed for traction and industrial markets. These modules are based on ABB’s soft-punch-through (SPT) and SPT+ technologies and come in different configurations, covering a wide voltage range from 1,200 to 6,500 V and a current range from 400 up to 2,400 A.

Key Features of HiPak Modules:

1. Variety of Configurations:
   • Available in single IGBT, dual IGBT, dual diode, and chopper configurations.
2. Wide Voltage and Current Range:
   • Voltage range: 1,200 to 6,500 V.
   • Current range: 400 to 2,400 A.
3. Isolation Voltage Categories:
   • Three isolation voltage categories of 4, 6.2, and 10.2 kVRMS are offered.
4. Main Functions of Package Design:
   • Provide a current path from the busbar to the chip and back.
   • Effective cooling system to prevent overheating.
   • Electrical contacts isolated from each other.
   • Mechanical robustness.
5. Cross-Sectional Overview:
   • A simplified cross-section is provided, illustrating different components of the HiPak module.
   • Red parts show the current path design.
   • Blue parts represent the thermal path design.
   • Green area indicates the electric isolation design and overall mechanical design.
6. Environmental Demands:
   • The harsher the environment, the greater the demands on the module packaging.
   • The package design should enable the module to operate for at least 30 years.
7. Challenges in Thermal Cycles:
   • Thermal cycles, caused by power load cycles, stress the module package.
   • Different coefficients of thermal expansion (CTE) in materials and solder joints are potential stress points during temperature changes.
   • Contact between bond wires and chip metallization may face challenges during short cycles with low temperature differences.

Conclusion:

The text provides insights into the design and functionality of ABB’s HiPak modules, emphasizing their applications in demanding environments such as traction and industrial markets. The module design addresses key functions, including current path provision, effective cooling, electrical isolation, and mechanical robustness, while considering challenges associated with thermal cycles. If you have further questions or need additional details, feel free to ask.