ABB LDGRB-01 3BSE013177R1 S800 I/O series spare card I/O module

Description

In the context of large-scale production expansion of global wafer manufacturers, upstream equipment manufacturers have ushered in a sustained high boom; LDGRB-01 Recently, ASML pointed out that chip manufacturers will face the problem of equipment shortage in the next two years, which once again confirms the prosperity of the industry.

On March 21, according to media reports, ASML, the world’s largest photolithographic supplier of LDGRB-01, pointed out that chip manufacturers will face equipment shortage in the next two years.
TSMC has made it clear that it will invest 100 billion dollars in the next three years to build plants and expand production.
According to SEMI prediction, the global wafer fab capital expenditure will exceed 140 billion dollars in 2022. TSMC’s capital expenditure plan in 2022 will reach US $40-44 billion, up 46.5% from US $30.04 billion in 2021.
The capital expenditure guideline of SMIC International in 2022 is 5 billion yuan, and SMIC Beijing and Shenzhen projects will be put into production in 2022. In addition, Huahong Semiconductor, Sloan Micro, China Resources Micro, Wentai Technology and other manufacturers are promoting production expansion. With the large-scale and continuous expansion of domestic and foreign wafer factories, it will bring at least 2-3 years of prosperity for upstream equipment manufacturers.
Susquehanna Financial Group data shows that in February 2022, the average global chip delivery time has been extended to more than half a year, creating a new high.
The most lacking chip is still MCU, with an average delivery time of 35.7 weeks, more than 8 months, followed by power chip, with an average delivery time of 1.5 weeks higher than that of last month.
The domestic automobile electric intelligence is advancing rapidly, and the demand for automobile electronics is also high, but the overall automobile autonomy rate is less than 5%. Therefore, during the two sessions, several NPC and CPPCC representatives from automobile manufacturers put forward the proposal to develop automobile specification level chips. The Ministry of Industry and Information Technology is also encouraging automobile manufacturers and chip manufacturers to cooperate in innovation and improve the supply capacity of domestic chips.
In 2021, the global chip capacity will be cut off, and the price of the wafer foundry will rise collectively. The semiconductor industry will usher in a new year of explosion. The A-share semiconductor index will increase by 33% annually, and the Philadelphia semiconductor index will increase by 41%.
This year, even under the background of such a bearish market environment for LDGRB-01, the semiconductor sector as a whole is still very strong.
In the past, everyone’s impression on the wafer industry was that “the eldest brother eats meat, the second brother drinks soup, and the third brother drinks the wind from the west to the north”. The concentration of chip design manufacturers in the industry was relatively high. The middle and high-end orders were basically monopolized by TSMC and Samsung, and the manufacturers in the back row really could only get a small profit from low-end OEM.
All of this will take an important turn in 2021. In addition to the orders for high-end laptop processors and mobile phone processors (basically in TSMC), the downstream automotive electronics, artificial intelligence and the Internet of Things industries will erupt in a centralized manner, and the whole line of low-end chip OEM will be fully produced.

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