Description
GE General Electric Technical Specifications: IS200HSLAH1ADE
Both of these PCIF cards have a 25-pin I/O expansion connector that connects to standard Series
90-30 Expansion and Remote IS200HSLAH1ADE baseplates (see the “Baseplates” chapter) via I/O expansion cabling.
Remote racks can be located up to 700 feet ( 213 meters) and Expansion racks up to 50 feet (15
meters) from the personal computer. Several standard prewired I/O expansion cables are available
from GE Fanuc. Alternately, custom length cables can be built. Please refer to Appendix C of this
manual for information on standard and custom I/O expansion cables.
These cards also provide connections to an internal watchdog-supervised RUN output relay contact.
This IS200HSLAH1ADE contact is closed under normal operating conditions, but opens if the computer or software
application fails, which makes it useful for interfacing with external safety circuits.
These cards support all Series 90-30 discrete and analog I/O modules (except 16-channel analog
modules). A variety of smart modules from Horner Electric, Inc. are also supported.
NOTE: The Programmable Coprocessor Modules, Communications Control module,
Alphanumeric Display Coprocessor module, and the State Logic Processor module are
currently NOT supported by the Personal Computer Interface (PCIF) cards.
brand | Product Name | Product model | Order No |
GE Fanuc | Module card | IS200HSLAH1ADE | nothing |
Place of Origin | Marketable land | Imported or not | defects liability period |
Europe and America | Nationwide and overseas | yes | a year |
Place of shipment | Delivery method | How to use | Applicable industries |
Xiamen | Shunfeng Express | Commissioning and installation | Power Plant Steel Plant Cement Plant Shipboard Papermaking |
Service advantages | Foreign import, goods preparation and supply | Reasonable price and reliable quality | Pictures are for reference only |
Product features | Primary source of goods, supply by model | After sales guarantee | Chen 1810693-7731 |
IS200HSLAH1ADE Most PLCs are mounted in an enclosure. The enclosure should be capable of properly
dissipating the heat produced by all of the devices mounted inside it. This appendix describes
how to calculate heat dissipation for a Series 90–30 PLC. The strategy is to calculate a heat
dissipation value, in Watts, for each individual module in the PLC. Then these individual
values will be added together to obtain a total heat dissipation figure for the PLC. When
making your calculations, don’t forget the following:
To convert percent to a decimal, move the decimal two places to the left. For example,
40% would be expressed as 0.40, and 100% would be 1.00.
To convert milliamps (mA) to Amperes (A or Amps), move the decimal three places to the
left. For example, 10mA would convert to .010A, and 130mA would convert to 0.130A.
Step 1: IS200HSLAH1ADE Basic Method to Calculate Module Dissipation
Note that this step does not apply to Power Supply Modules, which are covered in Step 2. The
values needed for this calculation are found in the “Load Requirements” table in the
“Calculating Power Supply Loading” section in Chapter 4 (“Power Supplies”). We will use the
basic electrical power formula in these calculations
Power (in Watts) = Voltage (in Volts) x Current (in Amps).
We will assume that all input power to these modules is eventually dissipated as heat. The
procedure is:
Look up the module in the “Load Requirements” table (Chapter 4) and obtain the current
values for each of the three power supply voltages listed. The voltage is printed at the head
of each column. All modules use the 5VDC supply, and a relatively few modules also use
one or both of the two 24VDC supplies.
For a given module, calculate the power dissipation for each column in the table that
contains a current value by multiplying the current value (in Amps) times the voltage for
that column. For modules using more than one voltage, add the calculated power values to
arrive at the total for the module.
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The maximum number of 8-Channel Analog Current/Voltage Output modules that can be installed
in a system are:
4 in a system using CPU Models 311, 313, or 323
8 in a system using CPU Model 331
32 in a system using CPU Models 340 and 341
64 in a system using CPU Models 350 – 364
Other Configuration Considerations
When planning the module configuration for your application you must also consider the load
capacity of the installed power supply and the total load requirements of all modules that are
installed in the baseplate.
Refer to Chapter 1 in this manual for details on power supply, baseplate, and module load
requirements. The following table lists the specifications for this module. Note that test conditions,
unless otherwise noted, are: VUSER = 24 VDC at an ambient temperature of 25 C (77 F)
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