GE IS200HSLAH1ADE high-speed serial link interface module

Product name:
GE IS200HSLAH1ADE high-speed serial link interface module

Product model: IS200HSLAH1ADE

Quantity: inventory

Part No./PN: IS200HSLAH1ADE

Warranty: We provide warranty service for IS200HSLAH1ADE

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Description

GE General Electric Technical Specifications: IS200HSLAH1ADE

Both of these PCIF cards have a 25-pin I/O expansion connector that connects to standard Series

90-30 Expansion and Remote IS200HSLAH1ADE baseplates (see the “Baseplates” chapter) via I/O expansion cabling.

Remote racks can be located up to 700 feet ( 213 meters) and Expansion racks up to 50 feet (15

meters) from the personal computer. Several standard prewired I/O expansion cables are available

from GE Fanuc. Alternately, custom length cables can be built. Please refer to Appendix C of this

manual for information on standard and custom I/O expansion cables.

These cards also provide connections to an internal watchdog-supervised RUN output relay contact.

This IS200HSLAH1ADE contact is closed under normal operating conditions, but opens if the computer or software

application fails, which makes it useful for interfacing with external safety circuits.

These cards support all Series 90-30 discrete and analog I/O modules (except 16-channel analog

modules). A variety of smart modules from Horner Electric, Inc. are also supported.

NOTE: The Programmable Coprocessor Modules, Communications Control module,

Alphanumeric Display Coprocessor module, and the State Logic Processor module are

currently NOT supported by the Personal Computer Interface (PCIF) cards.

 

brand Product Name Product model Order No
GE Fanuc Module card IS200HSLAH1ADE nothing
Place of Origin Marketable land Imported or not defects liability period
Europe and America Nationwide and overseas yes a year
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IS200HSLAH1ADE Most PLCs are mounted in an enclosure. The enclosure should be capable of properly

dissipating the heat produced by all of the devices mounted inside it. This appendix describes

how to calculate heat dissipation for a Series 90–30 PLC. The strategy is to calculate a heat

dissipation value, in Watts, for each individual module in the PLC. Then these individual

values will be added together to obtain a total heat dissipation figure for the PLC. When

making your calculations, don’t forget the following:

To convert percent to a decimal, move the decimal two places to the left. For example,

40% would be expressed as 0.40, and 100% would be 1.00.

To convert milliamps (mA) to Amperes (A or Amps), move the decimal three places to the

left. For example, 10mA would convert to .010A, and 130mA would convert to 0.130A.

Step 1: IS200HSLAH1ADE Basic Method to Calculate Module Dissipation

Note that this step does not apply to Power Supply Modules, which are covered in Step 2. The

values needed for this calculation are found in the “Load Requirements” table in the

“Calculating Power Supply Loading” section in Chapter 4 (“Power Supplies”). We will use the

basic electrical power formula in these calculations

Power (in Watts) = Voltage (in Volts) x Current (in Amps).

We will assume that all input power to these modules is eventually dissipated as heat. The

procedure is:

Look up the module in the “Load Requirements” table (Chapter 4) and obtain the current

values for each of the three power supply voltages listed. The voltage is printed at the head

of each column. All modules use the 5VDC supply, and a relatively few modules also use

one or both of the two 24VDC supplies.

For a given module, calculate the power dissipation for each column in the table that

contains a current value by multiplying the current value (in Amps) times the voltage for

that column. For modules using more than one voltage, add the calculated power values to

arrive at the total for the module.

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The maximum number of 8-Channel Analog Current/Voltage Output modules that can be installed

in a system are:

4 in a system using CPU Models 311, 313, or 323

8 in a system using CPU Model 331

32 in a system using CPU Models 340 and 341

64 in a system using CPU Models 350 – 364

Other Configuration Considerations

When planning the module configuration for your application you must also consider the load

capacity of the installed power supply and the total load requirements of all modules that are

installed in the baseplate.

Refer to Chapter 1 in this manual for details on power supply, baseplate, and module load

requirements. The following table lists the specifications for this module. Note that test conditions,

unless otherwise noted, are: VUSER = 24 VDC at an ambient temperature of 25 C (77 F)

livery can be arranged on the same day after the contract payment is signed
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